The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1):.ltoreq..times..ltoreq. ##EQU00001## wherein E.sub.0 represents an exposure amount in mJ/cm.sup.2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm.times.187 mm and a step size of 3 mm.times.12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E.sub.1 represents an exposure amount in mJ/cm.sup.2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.