This application discloses the structure of an ESC stage where a chucking
electrode is sandwiched by a moderation layer and a covering layer. The
moderation layer and the covering layer have the thermal expansion
coefficients between the dielectric plate and the chucking electrode.
This application also discloses the structure of an ESC stage where a
chucking electrode is sandwiched by a moderation layer and a covering
layer, which have internal stress directed oppositely to that of the
chucking electrode. This application further discloses a substrate
processing apparatus for carrying out a process onto a substrate as the
substrate is maintained at a temperature higher than room temperature,
comprising the electrostatic chucking stage for holding the substrate
during the process.