A method of making an electronic label, such as an RFID label, includes attaching a circuit, such as an antenna, to a substrate material, applying an adhesive layer to the substrate material over the circuit, adding a release layer over the adhesive layer, forming at least one opening in the release layer to expose at least one portion of the circuit, and connecting a microchip to the at least one portion of the circuit through the at least one opening. The electronic label includes a substrate having on one surface a circuit including at least one microchip, a layer of adhesive covering the circuit and the one surface of the substrate, and a release layer covering the adhesive layer. The circuit can be an RFID inlay, including an antenna and a microchip, and can be formed of a conductive ink. A portion of the release layer at the at least one microchip has an opening to expose the at least one microchip so that the at least one microchip is free from coverage by the release layer.