This invention concerns a floor buried system for heat distribution comprising heating means of a heating fluid, a pump, at least a rack (12) to which are coupled at least a supply pipe (13), at least a return pipe (18) and connection means characterised in that said at least a rack (12) comprises at least a supply collector pipe (14), at least a return collector pipe (17) and a plurality of supply pipes (1 11), said supply collector pipe (14) being connected to said supply pipe (13), through which the heating fluid flows by means of said pump, heated by said heating means, and in that said supply collector pipe (14) is connected to said plurality of supply pipes (1 11) which reach said at least return collector pipe (17), said at least a return collector pipe (17) being coupled to said at least a return pipe (18) from which outflows said heating fluid cooled.

 
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> Integrated liquid cooling system for electronic components

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