It is determined whether it is necessary to execute processing for automatically measuring a shot compensation parameter. Processing is reduced by performing automatic measurement of the shot compensation parameter only when such measurement is necessary. This is followed by measuring a wafer compensation parameter automatically. Depending upon whether or not automatic measurement of the shot compensation parameter has been performed, it is determined whether to calculate a relative parameter .delta. between the shot compensation parameter and wafer compensation parameter or to calculate a shot compensation parameter from a stored relative parameter .delta. and a wafer compensation parameter. This maintains alignment precision. The units comprising the apparatus are driven to perform exposure in accordance with the shot compensation parameter and wafer compensation parameter obtained.