A chip package is provided. The chip package includes at least one chip,
an interconnection structure, a plurality of second pads and at least one
panel-shaped component, wherein the chip includes a plurality of first
pads on a surface thereof. The interconnection structure is disposed on
the chip, and the first pads of the chip are electrically coupled to the
interconnection structure. The second pads are disposed on the
interconnection structure, and the panel-shaped component is embedded in
the interconnection structure. The panel-shaped component also includes a
plurality of electrodes on its two opposite surfaces, and the second pads
are electrically coupled to the first pads of the chip through the
interconnection structure and the panel-shaped component.