A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive layers and a plurality of insulating layers alternately placed along the length of the conductive element. The conductive element is placed between the edge of the circuit board having the conductive traces and a clasp prior to inserting the circuit board into the clasp. The conductive element is conformed between the circuit board and the clasp. Each conductive trace contacts a conductive layer as a result of the insertion. The backstop conforms an extending portion of the conductive element to be substantially perpendicular to the circuit board. The assembled device can be used to provide charge to a plurality of electrodes on a substrate simultaneously.