A polishing pad enables efficient removal of a polishing product and an "old polishing liquid" remaining on a surface (polishing surface) or in through-holes of a polishing pad. The polishing pad has a polishing surface and a plurality of through-holes extending in the thickness direction, which communicate with each other by communication grooves. The through-holes have a diameter of, e.g., 2 to 5 mm. The aperture ratio of the through-holes is, e.g., 10 to 50% of the surface area of the polishing surface of the polishing pad. The depth of the communication grooves is, e.g., 40 to 60% of the thickness of the polishing pad. The width of the communication grooves is, e.g., 10 to 50% of the diameter of the through-holes.