The described embodiments relate to devices and cooling systems for same. One exemplary device includes a housing and at least one fan unit configured to move air through the housing. The device also includes a fluid channel comprising an impeller for moving fluid contained in the fluid channel, wherein the impeller is configured to be driven, at least in part, by air moving through the housing.

 
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> Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins

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