The invention drastically improves the accuracy of adhesion position of a liquid drop discharged by a liquid drop discharge method and makes it possible to form a fine and highly accurate pattern directly on a substrate. Therefore, one object of the invention is to provide a method for manufacturing a wiring, a conductive layer and a display device that can respond to upsizing of a substrate. Moreover, another object of the invention is to provide a method for manufacturing a wiring, a conductive layer and a display device that can improve throughput and the efficiency of use of material. The invention can improve the accuracy of adhesion position of a liquid drop drastically at the time of patterning a resist material, a wiring material, or the like directly by the liquid drop discharge method mainly on a substrate having an insulating surface. To be more specific, the invention is characterized in that: a liquid adhesion position on the surface of the substrate is scanned with a charged beam in accordance with a desired pattern immediately before a liquid drop is discharged by the liquid drop discharge method; and immediately thereafter, the liquid drop is charged with an electric charge of a polarity opposite to the charged beam and is discharged to improve the controllability of the adhesion position of the liquid drop to a great extent.