A photosensitive resin composition comprising a resin (A1) having fluorine atom-containing groups, silicon atom-containing groups and ethylenic double bonds, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having at least three ethylenic double bonds per molecule. Further, a photosensitive resin composition comprising a resin (A2) having fluorine atom-containing groups and ethylenic double bonds, a resin (A3) having silicon atom-containing groups and ethylenic double bonds, a radical initiator (B), and an alkali-soluble photosensitive resin (D) having at least three ethylenic double bonds per molecule.