An integrated circuit and an associated packaged integrated circuit are provided which improve testability and reduce the test costs. The integrated circuit contains an integrated functional circuit to be tested, a test interface that connects the functional circuit to a test apparatus which performs a function test on the functional circuit to ascertain a test result, and an integrated self-marking apparatus that produces a marking on the basis of the test result. The marking can be magnetic or optical or electrical, volatile or nonvolatile, and thermally or electrically activated. The test apparatus includes an external test unit or an integrated self-test unit. Nonvolatile memory elements store the test results in a buffer.