To provide a wafer cleaning method capable of restricting breakage of fine
structures disposed on a wafer, and a spin cleaning apparatus enabling
such cleaning. The spin cleaning apparatus injects a cleaning liquid on a
wafer surface while moving a nozzle, and at the same time, with an
ultrasonic wave generated inside the nozzle, irradiates a cleaning liquid
collision spot, thereby cleaning the wafer surface. The above apparatus
includes at least one of the following functions: (1) a function of
varying the rotation frequency of the wafer; (2) a function of varying
the traveling speed of the nozzle in the direction parallel to the wafer;
(3) a function of varying the output of the ultrasonic wave; and (4) a
function of varying the distance between the nozzle and the cleaning
liquid collision spot, all corresponding to the position of the cleaning
liquid collision spot on the wafer.