A method of fabricating a microelectronic multi-chip module comprises: providing a cavity down ball grid array having a die and solder balls on a die side thereof; providing a package including at least one die thereon on a die side thereof; stacking the package onto the backside of the ball grid array opposite from the die side of the ball grid array. The backsides of the ball grid array and of the package may include land pads for providing interconnection between the ball grid array and the package during stacking.