An apparatus for accepting and transferring at least one disk-like member is provided. The apparatus includes a pick- and place-mechanism including gripping means. In effect, the mechanism is adapted to provide pick- and/or place-cycles, which during operation provides a movement of said gripping means between an up and a down position and vice versa, whereby, in the down position, said gripping means either picks the disk-like member from a load position or places the disk-like member onto the load position.

 
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> Wafer edge with light sensor

~ 00357