A cooler for electronic components comprises a heatsink, a blower, and an electric drive with a rotor and a stator. The heatsink comprises heat-exchanging means, inflow and outflow openings, and a base providing thermal contact with said electronic components and said heat-exchanging means. The blower comprises a radial impeller, a casing with an inlet, and heat-exchanging elements that are located in an outflow path of the blower and are in the thermal contact with said heat-exchanging means. The outflow opening of the heatsink being coincided with said inlet of the blower thus cooling gas flows through said heat-exchanging means, said blower inlet, said radial impeller, and said heat-exchanging elements in a series way. The heatsink comprises a cover plate from the high heat conducting material with an outflow opening, and at least a part of said cover plate is made as a part of said casing. The side parts of said casing are made from the high heat conducting material and are in the thermal contact with said heat-exchanging means.