A three-dimensional computer infrastructure cooling system is provided.
The three-dimensional computer infrastructure cooling system includes at
least one compute, storage, or communications brick. In addition, the
three-dimensional computer infrastructure cooling system includes at
least one coldrail to facilitate the removal of heat from the at least
one compute, storage, or communications brick. Also, the
three-dimensional computer infrastructure includes a brick-internal
carrier within the at least one compute, storage, communications brick,
wherein the brick-internal carrier is attached to the at least one
coldrail. Moreover, the three-dimensional computer infrastructure
includes a power dissipating electronic element within the at-least-one
compute, storage, or communications brick, wherein the power dissipating
element is attached to the brick-internal carrier.