The present invention features a method of patterning a substrate that includes forming, on the substrate, a first film having an original pattern that includes a plurality of projections a subset of which extends from a nadir surface terminating in an apex surface defining a height therebetween. A second film is disposed upon the first film and defines a surface spaced-apart from the apex surface of the plurality of projections. A variation in a distance between the apex surface of any one of the plurality of projections and the surface being within a predetermined range. A recorded pattern is transferred onto the substrate that corresponds to the original pattern, within the predetermined range being selected to minimize pattern distortions in the recorded pattern.