Provided herein are methods of preparing conductive particles including hydrophilizing the surface of polymer particles by a low-temperature plasma treatment; and coating the hydrophilized surface of the polymer particles with a conductive metal layer to form the conductive particles. The methods provided herein may provide desirable adhesion between the conductive metal layer and the polymer particles and may minimize the aggregation of the polymer particles during plating. As a result, methods disclosed herein may provide for conductive particles having desirable electrical conductivity and reliability.