A heat-dissipating structure. The heat-dissipating structure comprises a plurality of first and second conductive plates. Each first conductive plate has a first base surface, a first reference surface and a first main disturbing portion disposed on the first base surface and the first reference surface, and each second conductive plate has a second base surface, a second reference surface and a first sub disturbing portion disposed on the second base surface and the second reference surface. A middle passage, formed between two adjacent first and second conductive plates by facing the second base surface of the second conductive plate to the first reference surface of the first conductive plate, provides airflow passing therethrough with uniform flow resistance.