For measuring the three-dimensional shape of an object of measurement using a phase shift method, a three-dimensional shortening the measurement time. A printed state inspection device 1 includes a printed circuit board K printed with cream solder H, an illumination device 3 for illuminating three sine wave light component patterns with different phases on the surface of printed circuit board K, and a CCD camera 4 for picking-up images of the illuminated part of the printed circuit board K. A control device 7 creates a chart representing a relationship between brightness and coordinates for each light component from the image data obtained by the illumination of the light component patterns and determines relative phase angles among the light component patterns, and calculates the height of the cream solder H from the image data and the relative phase angles.