Techiques for forming a silicon quantum dot, which can be applied to the formation of a semiconductor memory device, are disclosed. The techniques may include depositing a first dielectric layer on a semiconductor substrate, depositing a polysilicon layer on the first dielectric layer, forming a plurality of metal clusters on the polysilicon layer in regular distance, and etching the polysilicon layer using the plurality of metal clusters as a mask. As disclosed herein, it is possible to form the silicon quantum dots having the fineness and uniformity characteristic together with the single crystalline level characteristic.

 
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> Ball grid array package, stacked semiconductor package and method for manufacturing the same

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