A method for manufacturing a semiconductor integrated circuit includes
steps of forming a semiconductor element on a semiconductor substrate and
separating only a function layer including the semiconductor element,
which is a surface layer of the semiconductor substrate, from the
semiconductor substrate. The semiconductor element is preferably a
compound semiconductor device including at least one of a light emitting
diode, a vertical cavity surface emitting laserdiode, a photodiode, a
high electron mobility transistor, an inductor, a capacitor, a resistor,
and a heterojunction bipolar transistor.