MEMS Sensor Systems and Methods are provided. In one embodiment, a method
for producing a six degree of freedom inertial sensor is provided. The
method comprises fabricating a first silicon wafer segment having at
least one inertial sensor pair, the at least one inertial sensor pair
comprising one or both of a pair of orthogonally oriented accelerometers
and a pair of orthogonally oriented gyroscopes; fabricating a second
silicon wafer segment having at least one inertial sensor, the at least
one inertial sensor comprising one or both of an accelerometer and a
gyroscope; assembling together the first silicon wafer segment and the
second silicon wafer segment such that the at least one inertial sensor
pair and the at least one inertial sensor are oriented orthogonal to each
other; and bonding the first silicon wafer segment to the second silicon
wafer segment.