Methods for cleaning and sterilizing devices, such as medical implants and prosthesis, surgical instruments and laboratory equipment. A method of the present invention includes the steps of placing the devices in a chamber of a furnace, evacuating the chamber of the furnace, heating the chamber of the furnace to a depyrogenation temperature, maintaining the chamber at the depyrogenation temperature for a depyrogenation time period, and introducing a flow of a sweep gas through the chamber of the furnace. The depyrogenation temperature may be between 250.degree. C. and 1000.degree. C. and the depyrogenation time period may be between about 45 minutes and 2.0 hours. The sweep gas may comprise any inert gas such as Nitrogen, Argon, or any combination thereof.