The present invention provides a surface mount electronic module that is compatible with high-temperature processing in a reflow furnace or the like. This electronic module comprises a housing, an electronic device that comprises a printed circuit board and electronic components electrically connected to the printed circuit board and mounted within the housings, and a lead-frame comprising leads each having an inner end electrically connected to the printed circuit board within the housing and an outer end protruding from the housing. The inner ends of the leads are elastically pressed against said printed circuit board to thereby form an electrical connection with the printed circuit board.