A sputtering apparatus is provided with a DC power supply 1, an inverter 2 that converts DC voltage to AC voltage, a matching circuit 10 that transforms the AC voltage, a rectifier 4 that converts the transformed AC voltage to direct current, and a sputtering load 6. The matching circuit 10 has a transformer 3 that transforms AC voltage from the inverter 2, inductance L provided in series with at least one of the primary winding 31 and secondary winding 32, and a condenser C provided in parallel with at least one of the primary winding 31 and secondary winding 32 through inductance L.