Semiconductor device (1) and process for fabricating it, the device (1) including an electrical connection support plate (2), an integrated circuit chip placed at a certain location on the support plate (2) and placed at a certain distance from this support plate (2), a plurality of electrical connection balls connecting electrical connection regions (4) of the support plate (2) and corresponding electrical connection pads on the integrated circuit chip, and a fill material at least partly filling the space separating the chip from the plate, and in which the surface of the support plate (2), which has the electrical connection regions (4), is provided with an interlayer (6) made of an insulating material in which apertures (7) are provided above the electrical connection regions (4) and above complementary flow channels (9, 10).