An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.

 
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> Thermal managed interconnect system for a circuit board

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