An LED illumination source comprises a heat dissipating substrate which
includes a metal plate and at least two insulating layers thereon. LEI)
bare chips are mounted on a surface of the substrate. An optical
reflector with holes surrounds the LED bare chips. The optical reflector
is provided on the surface of the substrate on which the LED bare chips
are mounted. A resin encapsulates the entire optical reflector on the
substrate, the resin molding each of the LED bare chips and functioning
as an optical lens for each of the LED bare chips.