An OBO planar waveguide device includes an Si substrate, an SiO.sub.2 layer formed on the Si substrate, and a plurality of Si optical waveguides provided on the Si substrate in parallel to each other. A heater and a heat sink are provided on opposing side end portions of the Si substrate respectively. As a result of a function of the heater and the heat sink, gradient of temperature distribution of the Si substrate is formed in a direction in which the plurality of Si optical waveguides are aligned. Thermal resistance of the Si substrate in the direction in which the gradient of temperature distribution is formed is greater than 20 K/W and lower than 2000 K/W. The OBO planar waveguide device attaining reduced power consumption is thus obtained.

 
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