The present invention relates to a method for suppressing mold formation
on building parts using hydrophobic substances, wherein a dispersion of
hydrophobic particles having a mean particle diameter of from 0.005 to 5
.mu.m in an organic dispersant is applied to the surface to be protected
from mold attack and the dispersant is then removed, and to a composition
for building parts which inhibits mold growth and comprises from 0.1 to
10% by weight of hydrophobic particles having a mean particle diameter of
from 0.005 to 5 .mu.m dispersed in an organic dispersant.