The present invention provides a method of bonding an adherend to a
substrate which comprises applying a curable composition comprising at
least one polymer or resin selected from the group consisting of (A) a
reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive
silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of
which molecular chain is substantially made of one or more alkyl acrylate
monomer unit(s) and/or alkyl methacrylate monomer unit(s) and (D) an
epoxy resin and having a viscosity before curing of not lower than 10,000
Pas as determined on a B8U type viscometer under the following condition;
rotor No. 7; number of revolutions 0.5 rpm; in an atmosphere at
23.degree. C., according to JIS K 7117 to the adherend and/or substrate
and then joining the adherend and the substrate together without
temporary tacking. By using a moisture-curable adhesive composition
having a specific composition and a specific viscosity, it becomes
possible to bond adherends without open time and without temporary
tacking after application.