A support and a method for assembling micro-components to binding sites on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid having first micro-components adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas proximate to the selected binding sites so as to inhibit first micro-components from engaging the binding sites.