A novel imide silicone resin is provided that on heat treatment is capable of easily forming a cured resin coating with excellent solvent resistance, humidity resistance and durability, as well as a production process therefor. The imide silicone resin has a structure of the formula (1) shown below, which is the addition reaction product of an organopolysiloxane with two silicon-bonded hydrogen atoms, and an imide compound with two olefin-based carbon-carbon double bonds ##STR00001##

 
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> Pyrazole derivatives and process for the production thereof

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