A ferroelectric film is formed by an oxide that is described by a general formula AB.sub.1-xNb.sub.xO.sub.3. An A element includes at least Pb, and a B element includes at least one of Zr, Ti, V, W, Hf and Ta. The ferroelectric film includes Nb within the range of: 0.05.ltoreq.x<1. The ferroelectric film can be used for any of ferroelectric memories of 1T1C, 2T2C and simple matrix types.

 
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> Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices

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