A computer system may include one or more modules coupled to a backplane in a housing. A module support structure may allow cooling air to flow upwardly across the modules. In one embodiment, a power section of the module may be located downstream of a data section of the module. In another embodiment, offset brackets may hold a circuit board of a module at an offset relative to a pair of guides in a module support structure. In another embodiment, a heat sink may be coupled between heat producing components on a pair of adjacent modules. In another embodiment, a converter apparatus may support a plurality of modules in a different number of slots in a system. In another embodiment, a heat sink on a module may include a pair of heat pipes arranged such that the heat pipes diverge from one another toward the condenser ends of the heat pipes.