A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second contacts formed on the upper surface of the substrate, wherein one of the first contacts is electrically connected to one of the second contacts. The chip has an active surface and a boding pad formed on the active surface and is disposed in the opening, Moreover, an electrically conductive layer is disposed above the upper surface of the substrate and the active surface of the chip, and extended from the upper surface of the substrate to the active surface of the chip so as to electrically connect the chip and the substrate. In addition, a protective layer is provided to dispose above the electrically conductive layer and expose the second contacts so that the second contacts can electrically connect to external electronic devices.