A semiconductor device (102) that includes a drain extended PMOS transistor (CT1a) is provided, as well as fabrication methods (202) therefore. In forming the PMOS transistor, a drain (124) of the transistor is formed over a region (125) of a p-type upper epitaxial layer (106), where the region (125) of the p-type upper epitaxial layer (106) is sandwiched between a left P-WELL region (130a) and a right P-WELL region (130b) formed within the p-type upper epitaxial layer (106). The p-type upper epitaxial layer (106) is formed over a semiconductor body (104) that has an n-buried layer (108) formed therein. This arrangement serves to increase the breakdown voltage (BVdss) of the drain extended PMOS transistor.