Semiconductor devices, other electronic components, and other articles of manufacture with porous insulator structures are disclosed. The insulative material of such porous insulators may include a first, substantially nonporous state and a second, porous state. When in the first state, the insulative materials may be processed or support layers or structures which are being processed. When in the second state, the insulative materials have a reduced dielectric constant and, thus, increased electrical insulation properties. For example, an insulative material may include a consolidatable material with one or more microcapsules therein. Each microcapsule includes a shell and may also include a removable filler. The consolidatable material may be cured and the filler, if any, removed to form a porous insulator structure.