An object of the present invention is to provide a polyamide resin composition having high mechanical properties and high heat resistance while achieving a satisfactory balance between various physical properties. A molded product made of this polyamide resin exhibits a lower warpage and excellent surface appearance. A method for producing the polyamide, resin composition is also provided. The present invention provides a polyamide resin composition containing a polyamide resin and swelling mica treated with a polyether compound having a bisphenol structure. The present invention also provides a method for making the polyamide resin composition including melt-mixing a polyamide resin with a polyether compound.