A method for carrying a semiconductor device includes: (a) providing
semiconductor devices each having a main surface, a back surface, and a
plurality of external terminals; (b) providing a tray having a front
surface, a rear surface, an electronic tag imbedded in the tray, first
concaved portions formed on the front surface, second concaved portions
formed on the rear surface, the electronic tag constituted by a
non-contact recognition type chip having a memory circuit in which
recognizable information is stored, a depth of the first concaved portion
is deeper than a depth of the second concaved portion; (c) housing the
semiconductor devices into the first concaved portions respectively in
such a manner that the back surface of the semiconductor device being
oppose to a bottom of the first concaved portion; and (d) carrying the
tray with the semiconductor devices.