Disclosed is a process for preparing a compound of the formula ##STR00001## wherein R.sub.1 is an alkyl group having at least one ethylenic unsaturation, an arylalkyl group having at least one ethylenic unsaturation, or an alkylaryl group having at least one ethylenic unsaturation, R.sub.2 and R.sub.3 each, independently of the others, are alkylene groups, arylene groups, arylalkylene groups, or alkylarylene groups, and n is an integer representing the number of repeat amide units and is at least 1, said process comprising: (a) reacting a diacid of the formula HOOC--R.sub.2--COOH with a diamine of the formula ##STR00002## in the absence of a solvent while removing water from the reaction mixture to form an acid-terminated oligoamide intermediate; and (b) reacting the acid-terminated oligoamide intermediate with a monoalcohol of the formula R.sub.1--OH in the presence of a coupling agent and a catalyst to form the product.

 
Web www.patentalert.com

> Semiconductor device with lead-free solder

~ 00373