A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a heat path from the electronic device and provides mechanical compliance. The structure further includes a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements, and a liquid with vaporizing capability disposed with the space contained.