The present invention provides a semiconductive belt including a substrate and a surface layer, wherein: the substrate contains a resin; the Young's modulus of the substrate is 1000 to 8000 MPa; the surface layer contains a lubricant component, a fibrous filling material, and an elastic material; and the durometer hardness of the surface layer is A30/S to A70/S.

 
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> Solder for use on surfaces coated with nickel by electroless plating

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