An electrical assembly comprises an electrical connector, and an improved pickup cap that is provided with a surface area configuration that has the potential to impart a more even temperature distribution across the ball grid array during reflow. Some embodiments of the pickup cap, when connected to the electrical connector, cover the sides of the electrical connector, but do not cover the central portion of the electrical connector. Such a configuration of pickup cap surface areas has the potential to provide a more even temperature distribution across the grid of solder balls during reflow of the solder balls.