An IC package includes a package body of non-conductive material. A
conductive heat-sink pad includes an interior pad portion located within
an interior of the package body. An exterior pad portion is located
external to the package body. The exterior pad portion includes at least
two pad pieces that are spaced apart to define at least one channel that
separates the at least two pad pieces, the at least two pad pieces being
electrically connected with each other. The at least two pad pieces may
be flush with an underside surface of the package body or one or more of
the pad pieces may extend outwardly from the package body.