A method of forming an improved seal ring structure is described. A continuous metal seal ring is formed along a perimeter of a die wherein the metal seal ring is parallel to the edges of the die and sloped at the corner of the die so as not to have a sharp corner and wherein the metal seal ring has a first width at the corners and a second width along the edges wherein the first width is wider than the second width.

 
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> Methods and apparatus for packaging integrated circuit devices

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