A method for packaging a radio frequency integrated circuit (RFIC) in multiple packages begins by determining a 1.sup.st position of the RFIC die in a 1.sup.st package wherein the positioning is such to minimize adverse affects of parasitic components of coupling between the radio frequency input/output section and an antenna. Once the position within the 1.sup.st package has been determined, the corresponding parasitics are measured to determine their values. The processing then continues by determining a 2.sup.nd position of the RFIC die in a 2.sup.nd package based on the values of the parasitic components. Accordingly, the 2.sup.nd position places the die within the 2.sup.nd package such that the parasitic components of coupling between the RF I/O section to the antenna within the 2.sup.nd package substantially matches the parasitic components of coupling the RFIO section to the antenna in the 1.sup.st package. Accordingly, different packages may be used with the same RFIC die, while maintaining the desired noise reduction.