A heat dissipation device for dissipating heat from an electronic element includes a heat spreader (12) for contacting with the electronic element, a conducting member (30) having a lower base plate (32) thermally contacting with the heat spreader and an upper base plate (34) with a plurality of first fins (36) extending downwardly from the upper base plate towards the lower base plate and a connecting portion (33) interconnecting the lower and upper base plate. A plurality of second fins (38) is mounted on the conducting member. A plurality of heat pipes (40) thermally connects the heat spreader and the conducting member and the second fins to transfer heat from the heat spreader to the conducting member and the second fins. A fan (20) is mounted adjacent to air passages of the first and second fins for generating a forced airflow through the air passages.